News by Subject Technology & Engineering

A collaboration between EPFL and UCSB has developed a long-anticipated breakthrough, and demonstrated CMOS technology -- used for building microprocessors and memory chips -- that allows wafer-scale manufacturing of chip-scale optical frequency combs.

Researchers at the Georgia Institute of Technology, Nokia Bell Labs, and Heriot-Watt University have found a low-cost way for backscatter radios to support high-throughput communication and 5G-speed Gb/sec data transfer using only a single transistor when previously it required expensive and multiple stacked transistors.

Engineers developed inexpensive methods to make "impossible materials" that interact in unusual ways with microwave energy. Thin film polymers inkjet printed with tiny component patterns collect or transmit energy with much greater selectivity, sensitivity, and power than conventional materials.

University of Rochester researchers describe the first demonstration of highly chirped pulses created by a using a spectral filter in a Kerr resonator, enabling them to widen a laser pulse wavefront by separating the beam's colors. The chirped pulses remain stable even with more than 90% energy loss.

Scientists at Tokyo Institute of Technology and NEC Corporation jointly develop a 28-GHz phased-array transceiver that supports efficient and reliable 5G communications. The proposed transceiver outperforms previous designs in various regards by adapting fast beam switching and leakage cancellation mechanism.